Silicon die substrate manufacturing process and silicon die...

Details Silicon die substrate manufacturing process and silicon die... Silicon die substrate manufacturing process and silicon die...

2007-07-31

2007-07-31

Jackson, Jerome (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S122000, C438S135000, C438S689000, C438S637000, C257S706000, C257S712000, C257S737000, C257S774000, C257S777000

Reexamination Certificate

active

10883452

ABSTRACT:
In one embodiment a method is provided. The method comprises inserting a first end of a P-type semiconductor pin in a first through hole via in a substrate; inserting a first end of an N-type semiconductor pin in a second through hole via in the substrate; and electrically connecting the first ends of the P and N-type semiconductor pins to form a precursor Peltier cooling device which in cooperation with a semiconductor die, bridges the P and N-type semiconductor pins between their ends remote from the first ends to define a Peltier cooling device in the substrate.

REFERENCES:
patent: 5724818 (1998-03-01), Iwata et al.
patent: 6222113 (2001-04-01), Ghoshal
patent: 6408937 (2002-06-01), Roy
patent: 6586835 (2003-07-01), Ahn et al.
patent: 6588217 (2003-07-01), Ghoshal
patent: 6613602 (2003-09-01), Cooper et al.
patent: 6614109 (2003-09-01), Cordes et al.
patent: 6727423 (2004-04-01), Tauchi et al.
patent: 6787896 (2004-09-01), Petty-Weeks
patent: 6942018 (2005-09-01), Goodson et al.
patent: 6981380 (2006-01-01), Chrysler et al.
patent: 2005/0085075 (2005-04-01), Shimada et al.

Affiliated with

Also associated with

Rating

Silicon die substrate manufacturing process and silicon die... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Silicon die substrate manufacturing process and silicon die..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Silicon die substrate manufacturing process and silicon die... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3761481