Mounting structure for semiconductor parts and semiconductor...

Details Mounting structure for semiconductor parts and semiconductor... Mounting structure for semiconductor parts and semiconductor...

2007-09-04

2007-09-04

Ha, Nathan W. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Reexamination Certificate

active

10957739

ABSTRACT:
To arrange semiconductor parts such as chip resistors and the like between a BGA and a mounting substrate, an interposes is disposed between the BGA and the mounting substrate for mounting the BGA thereon. The interposer serves to maintain the distance between the mounting substrate and the BGA to be just as large as or larger than the thickness of the semiconductor parts and to electrically connect solder balls of the BGA and electrically conductive patterns of the mounting substrate. The semiconductor parts are mounted on the mounting substrate before fixing the BGA22to the interposer.

REFERENCES:
patent: 6313522 (2001-11-01), Akram et al.
patent: 6618267 (2003-09-01), Dalal et al.
patent: 6798070 (2004-09-01), Funaya et al.
patent: 6836011 (2004-12-01), Azuma
patent: 6952049 (2005-10-01), Ogawa et al.
patent: 2003/0214049 (2003-11-01), Hortaleza et al.
patent: 2003/0218235 (2003-11-01), Searls et al.
patent: 2004/0155335 (2004-08-01), Searls et al.
patent: 2004/0169277 (2004-09-01), Matsuda
patent: 2004/0173891 (2004-09-01), Imai et al.
patent: 2004/0178508 (2004-09-01), Nishimura et al.
patent: 2004/0188826 (2004-09-01), Palanduz et al.
patent: 2004/0235287 (2004-11-01), Inoue et al.
patent: 2004/0238942 (2004-12-01), Chakravorty et al.
patent: 2004/0262774 (2004-12-01), Kang et al.
patent: 2005/0006784 (2005-01-01), Nakayama
patent: 2005/0051903 (2005-03-01), Ellsberry et al.
patent: 2005/0082669 (2005-04-01), Saijo et al.
patent: 2005/0199991 (2005-09-01), Chao et al.
patent: 2006/0068523 (2006-03-01), Lin
patent: 4-62866 (1992-02-01), None

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