Equipment for bonding printed circuit boards

Details Equipment for bonding printed circuit boards Equipment for bonding printed circuit boards

2007-07-10

2007-07-10

Chang, Richard (Department: 3726)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S832000, C029S842000, C029S843000

Reexamination Certificate

active

10829255

ABSTRACT:
Equipment for bonding a flexible printed circuit board made of thermoplastic resin on a printed circuit board includes a heater and a jig. The heater head presses and heats the flexible printed circuit board. The jig prevents the thermoplastic resin from flowing out when the flexible printed circuit is bonded on the printed circuit board. The jig is to be disposed between the flexible printed circuit board and the heater head. The jig includes a thin plate having a base plate and a wing plate. The base plate is parallel to a top surface of the heater head to be sandwiched between the flexible printed circuit board and the heater head. The wing plate is disposed on both sides of the base plate to bend from the base plate.

REFERENCES:
patent: 6449836 (2002-09-01), Miyake et al.
patent: 6784375 (2004-08-01), Miyake et al.
patent: 7080445 (2006-07-01), Miyake et al.
patent: 2003/0079341 (2003-05-01), Miyake et al.
patent: A-10-270820 (1998-10-01), None
patent: A-2000-021930 (2000-01-01), None

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