Substrate processing apparatus

Details Substrate processing apparatus Substrate processing apparatus

2007-07-10

2007-07-10

Barr, Michael (Department: 1746)

Cleaning and liquid contact with solids

Apparatus

With means to movably mount or movably support the work or...

C134S158000, C134S902000, C134S149000

Reexamination Certificate

active

10446438

ABSTRACT:
A substrate processing apparatus includes a rotor45for rotating a plurality of wafers W paralleled each other at appropriate intervals. While rotating the wafers W by the rotor45, a chemical liquid is supplied to the wafers W for their processing. The rotor45has holding members95, 96, 97, 98, 99for holding the peripheries of the wafers W in parallel arrangement and a press member100for holding the wafers W while applying a pressure on their peripheries. Irrespective of rotation of the rotor45, the press member100always applies a pressure on the peripheries of the wafers W so as to prevent the peripheries from sifting with respect to the holding members95, 96, 97, 98, 99. With the action of the press member100, it becomes possible to prevent the peripheries of the wafers W from being worn and also possible to elongate the span of life of the holding members95, 96, 97, 98, 99while performing a chemical processing.

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