Selecting dice to test using a yield map

Details Selecting dice to test using a yield map Selecting dice to test using a yield map

2007-05-22

2007-05-22

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

C700S121000, C257SE21521

Reexamination Certificate

active

10902245

ABSTRACT:
Dice on a wafer are selected to be tested using a yield map. The yield map incorporates yield information of different products produced by the same fabrication process. A die placement for a product to be produced by the same process is determined based on the yield map. An expected yield for a die in the die placement is also determined based on the yield map. The expected yield for the die is then used to determine whether to test the die.

REFERENCES:
patent: 6393602 (2002-05-01), Atchison et al.
patent: 7013192 (2006-03-01), Whitefield et al.

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