Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2007-01-09
2007-01-09
Hollington, Jermele (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
Reexamination Certificate
active
11046883
ABSTRACT:
A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.
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Notice of Reasons of Rejection issued Apr. 30, 2002 by the Japan Patent Office w/the partial translation.
Y. Nakata et al.; “A Wafer Level Burn in Technology Using the Contactor Controlled Thermal Expansion”; Semiconductor Research Center, Matsushita Electric Industrial Co., Ltd. and Kyoto Laboratory, Matsushita Electronics Corporation; Apr. 3, 1997.
Notice of Reasons of Rejection mailed on Dec. 16, 2003 for the corresponding Japanese Application No. H10-263579.
Haseyama Makoto
Maruyama Shigeyuki
Tashiro Kazuhiro
Armstrong Kratz Quintos Hanson & Brooks, LLP
Fujitsu Limited
Hollington Jermele
Nguyen Trung Q.
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