Interconnect alloys and methods and apparatus using same

Details Interconnect alloys and methods and apparatus using same Interconnect alloys and methods and apparatus using same

2007-01-09

2007-01-09

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S752000, C257S768000

Reexamination Certificate

active

10405796

ABSTRACT:
Integrated circuit interconnect alloys having copper, silver or gold as the major constituent element. The resulting reduction in melting temperature allows for improved coverage of high aspect ratio features with reduced deposition pressure. The alloys are used to fabricate interconnects in integrated circuits, such as memory devices. The interconnects can be high aspect ratio features formed using a dual damascene process. The integrated circuits having the interconnects are applicable to semiconductor dies, devices, modules and systems.

REFERENCES:
patent: 4240845 (1980-12-01), Esch et al.
patent: 5789317 (1998-08-01), Batra et al.
patent: 6037257 (2000-03-01), Chiang et al.
patent: 6093265 (2000-07-01), Brenneman
patent: 6300234 (2001-10-01), Flynn et al.
ASM Handbook, vol. 3,Alloy Phase Diagrams, (1992), Table of Contents.
“Metallography, Structures and Phase Diagrams”,Metals Handbook Eighth Edition, 8, American Society for Metals, (1973),pp.
“Properties and Selection: Nonferrous Alloys and Pure Metals”,Metals Handbook Ninth Edition, vol. 2, American Society for Metals, Metals Park, Ohio, (1979),p. 673.
Elliott, R. P.,Constitution of Binary Alloys, First Supplement, (1985),2 pages.
Kaanta, C. , et al., “Dual Damascene: A ULSI Wiring Technology”,VMIC Conference, (Jun. 1991),144-152.
Moffatt, W. G.,The Handbook of Binary Phase Diagrams, 2, Genium Publishing Corporation,(1984), p. 6/80.
Robinson, R. N., “Periodic Table of Elements”,Chemical Engineering Reference Manual, Appendix D,(1987),3 pages.

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