Wafer packaging and singulation method

Details Wafer packaging and singulation method Wafer packaging and singulation method

2007-03-27

2007-03-27

Dang, Trung (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257SE23123, C257SE23124, C257SE23128

Reexamination Certificate

active

11340321

ABSTRACT:
A multi-device lid for a micro device wafer has a plurality of micro devices. The multi-device lid includes a multi-lid substrate configured to cover the plurality of micro devices of the micro device wafer. The multi-lid substrate has a trench pattern with intersection portions and non-intersection portions on a first side of the multi-lid substrate. The trench pattern is configured such that the intersection portions of the trench pattern extend adjacent to at least two of the plurality of micro devices when the multi-lid substrate is coupled to the micro device wafer.

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IMAPS Advanced Technology Workshop on Packaging of MEMS and Related Micro Integrated Nano Systems, Workshop Presentations, Hilton San Jose South/Scotts Valley, Scotts Valley, CA, Nov. 8-10, 2001.

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