Method of making blister pad adhesive bandage

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156251, 156289, 156290, 156324, 128155, 128156, 128169, A61L 1500, B32B 3118, B32B 3120

Patent

active

046220895

ABSTRACT:
Adhesive bandages comprising a blister pad and adjacent adhesive-coated areas are prepared from heat-fusible bandage materials, preferably a nonwoven batt material, by applying the pad material to a base material and heat-welding around the perimeter of the pad to totally enclose the interior thereof. The portions of the base material extending from the pad area are compacted under heat and pressure to provide a surface suitable for a coating with adhesive. A medicated gel or other therapeutic material may be included within the confines of the pad area to provide a medicated blister bandage.

REFERENCES:
patent: 2340142 (1944-01-01), Rauner
patent: 2521985 (1950-09-01), Lang et al.
patent: 3468096 (1969-09-01), Franz
patent: 3794537 (1974-02-01), Rahmes
patent: 3900027 (1975-08-01), Keedwell
patent: 3998988 (1976-12-01), Shimomai
patent: 4103054 (1978-07-01), Okamoto
patent: 4126130 (1978-11-01), Cowden et al.
patent: 4136221 (1979-01-01), Okamoto
patent: 4140677 (1979-02-01), Uno
patent: 4219019 (1980-07-01), Coates
patent: 4287251 (1981-09-01), King
patent: 4530353 (1985-07-01), Lauritzen

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