Method for measuring confidence of ball grid array model in...

Image analysis – Applications – Manufacturing or product inspection

Reexamination Certificate

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C029S833000, C438S016000

Reexamination Certificate

active

10420286

ABSTRACT:
A method for obtaining confidence measure of a ball grid array (BGA) model having a plurality of balls in semiconductor surface mounted devices is provided. The method comprises the steps of extracting BGA images from a real surface mounted device, generating a BGA ball model and a BGA body model, generating a first confidence measure of the BGA ball model wherein the first confidence measure includes a first standard deviation of the BGA ball model and a first local image contrast of each BGA ball, and generating a second confidence measure of the BGA body model wherein the second confidence measure includes a second standard deviation of the BGA body model and a second local image contrast of the BGA body.

REFERENCES:
patent: 5736790 (1998-04-01), Iyogi et al.
patent: 6177682 (2001-01-01), Bartulovic et al.
patent: 6496270 (2002-12-01), Kelley et al.
patent: 2004/0126005 (2004-07-01), Duvdevani et al.

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