Mold closing device with mold height adjustment and method...

Details Mold closing device with mold height adjustment and method... Mold closing device with mold height adjustment and method...

2007-05-15

2007-05-15

Heitbrink, Jill L. (Department: 1732)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Shaping against forming surface

C425S150000, C425S589000, C425S595000

Reexamination Certificate

active

10506343

ABSTRACT:
A mold height adjustment device for modifying the distance between the stationary mold carrier and a support element by means of a drive mechanism is provided in a plastic injection molding machining. A locking device locks the support element in its respective position. A release position is provided in the area of movement of the moving mold carrier, which unlocks the locking device when the moving mold carrier is in the release position, thereby providing a mold height adjustment device and a method for actuating the device, which advantageously uses the elements moving on the machine for its actuation.

REFERENCES:
patent: 4281977 (1981-08-01), Farrell
patent: 4341511 (1982-07-01), Laurent et al.
patent: 5275550 (1994-01-01), Romi
patent: 6655949 (2003-12-01), Chikazawa et al.
patent: 198 12 741 (1999-09-01), None
patent: 19945287 (2001-03-01), None
Brochure for “DUO” by Engel Vertriebsgesellschaft m.b.H.-A-4311 Schwertberg, Austria.
Brochure for “Moduline E-Series Machines” by Husky, Sep. 1996.
International Search Report for International Application No. PCT/EP02/13981 dated May 8, 2003.

Affiliated with

Also associated with

Rating

Mold closing device with mold height adjustment and method... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mold closing device with mold height adjustment and method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold closing device with mold height adjustment and method... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3754333