Method of producing ultra-thin copper foil with carrier,...

Details Method of producing ultra-thin copper foil with carrier,... Method of producing ultra-thin copper foil with carrier,...

2007-05-29

2007-05-29

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Microscopic interfacial wave or roughness

C428S615000, C428S618000, C428S621000, C428S656000, C428S660000

Reexamination Certificate

active

10929471

ABSTRACT:
An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 μm, and to produce the method of producing the foil, and further to produce a printed circuit board for fine pattern, a multilayer printed circuit board and a chip on film circuit board by using the ultra-thin copper foil with a carrier. The present invention provides an ultra-thin copper foil with a carrier produced by stacking a peeling layer and an ultra thin copper foil in order on the surface of a carrier copper foil which is made smooth so that the mean surface roughness of at least one side is Rz of 0.01 to 2.0 μm by the chemical polishing, the electrochemical dissolution, or the smoothing plating processing method independently, combining two or more, or further combining the mechanical polishing.

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