LGA socket with EMI protection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead

Reexamination Certificate

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Details

C257S726000, C257S727000, C257S735000, C257S736000, C257S737000, C257S780000, C257S781000

Reexamination Certificate

active

11078957

ABSTRACT:
A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. A grounding clip surrounds the housing and is conductively connected to the substrate, and has spring arms which are connectable to heat sink hardware on one side thereof and to a printed circuit board on the other side.

REFERENCES:
patent: 6042412 (2000-03-01), Murr
patent: 6224392 (2001-05-01), Fasano et al.
patent: 6375476 (2002-04-01), Goodwin et al.
patent: 6558169 (2003-05-01), Figueroa et al.
patent: 6586684 (2003-07-01), Frutschy et al.
patent: 6659512 (2003-12-01), Harper et al.
patent: 6706562 (2004-03-01), Mahajan et al.
patent: 6735085 (2004-05-01), McHugh et al.
patent: 6792375 (2004-09-01), Colbert et al.
patent: 6800947 (2004-10-01), Sathe
patent: 6929495 (2005-08-01), Ma
patent: 7083456 (2006-08-01), Trout et al.
patent: 2005/0207133 (2005-09-01), Pavier et al.

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