Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-05-08
2007-05-08
Vortman, Anatoly (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C257S707000
Reexamination Certificate
active
10956893
ABSTRACT:
A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.
REFERENCES:
patent: 4606962 (1986-08-01), Reylek et al.
patent: 5109318 (1992-04-01), Funari et al.
patent: 5313097 (1994-05-01), Haj-Ali-Ahmadi et al.
patent: 5475563 (1995-12-01), Donahoe et al.
patent: 5661339 (1997-08-01), Clayton
patent: 5731633 (1998-03-01), Clayton
patent: 5751553 (1998-05-01), Clayton
patent: 5793609 (1998-08-01), Donahoe et al.
patent: 5892660 (1999-04-01), Farnworth et al.
patent: 6049975 (2000-04-01), Clayton
patent: 6091145 (2000-07-01), Clayton
patent: 6232659 (2001-05-01), Clayton
patent: 6353538 (2002-03-01), Ali et al.
patent: 6362965 (2002-03-01), Bookhardt et al.
patent: 6362966 (2002-03-01), Ali et al.
patent: 6377460 (2002-04-01), Pohl et al.
patent: 6424532 (2002-07-01), Kawamura
patent: 6449156 (2002-09-01), Han et al.
patent: 6661661 (2003-12-01), Gaynes et al.
patent: 6781848 (2004-08-01), Farnworth et al.
patent: 7023700 (2006-04-01), Chiou et al.
patent: 7079396 (2006-07-01), Gates et al.
patent: 7106595 (2006-09-01), Foster et al.
patent: 2002/0001180 (2002-01-01), Kawamura
patent: 2002/0079117 (2002-06-01), Coffin et al.
patent: 2003/0193788 (2003-10-01), Farnworth et al.
patent: 2005/0276021 (2005-12-01), Gates et al.
patent: 2006/0056154 (2006-03-01), Foster et al.
patent: 2000251463 (2000-09-01), None
Chiou Ren-Kang
Ni Jim
Wang Kuang-Yu
Bever Patrick T.
Bever Hoffman & Harms LLP
Super Talent Electronics Inc.
Vortman Anatoly
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