Semiconductor device having a heat-dissipation member

Details Semiconductor device having a heat-dissipation member Semiconductor device having a heat-dissipation member

2007-05-15

2007-05-15

Ngô, Ngân V. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S712000, C257S713000, C257SE23036

Reexamination Certificate

active

10994680

ABSTRACT:
A semiconductor device is disclosed that includes a semiconductor element, a circuit board electrically connected to the semiconductor element, a heat dissipation member fixed to the first surface of the circuit board and thermally coupled to the semiconductor element, and an interposer provided to the second surface of the circuit board facing away from the heat dissipation member. The interposer is electrically connected to the circuit board. An opening is formed in the circuit board and the interposer so that the semiconductor element is thermally coupled directly to the heat dissipation member through the opening.

REFERENCES:
patent: 6081426 (2000-06-01), Takeda et al.
patent: 2004/0135246 (2004-07-01), Kim et al.
patent: 2005/0046017 (2005-03-01), Dangelo
patent: 2005/0269689 (2005-12-01), Tetsuka
patent: 2000-216284 (2000-08-01), None
patent: 2001-168244 (2001-06-01), None
patent: 2003-204015 (2003-07-01), None
patent: WO98/49726 (1998-11-01), None

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