Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-05-08
2007-05-08
Gilman, Alexander (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
10988317
ABSTRACT:
The present invention include a main substrate on which electronic components are mounted; a secondary substrate wherein electronic components are mounted on a surface facing a mounting surface of the main substrate; and a shield perimeter wall formed by arranging multiple shielded substrate connectors connecting the main substrate and the secondary substrate so that an electronic circuit is surrounded. The shielded substrate connectors is formed from plugs mounted on either main or secondary substrate and sockets mounted on the other substrate, the plugs and the sockets being removably connected. The plugs and the sockets are attached to the main substrate and the secondary substrate with an attachment tool member that supports the plugs or sockets so that they are aligned with the shield perimeter wall.
REFERENCES:
patent: 5836773 (1998-11-01), McHugh et al.
patent: 5842874 (1998-12-01), Yagi et al.
patent: 5915975 (1999-06-01), McGrath
patent: 5921814 (1999-07-01), Maruyama
patent: 6077121 (2000-06-01), Wu
patent: 06-338435 (1994-12-01), None
Patent Abstracts of Japan for JP06-338435 published on Dec. 6, 1994.
Darby & Darby
Gilman Alexander
SMK Corporation
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