Method and apparatus for expanding a semiconductor wafer

Details Method and apparatus for expanding a semiconductor wafer Method and apparatus for expanding a semiconductor wafer

2007-05-29

2007-05-29

Osele, Mark A. (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C438S464000, C438S976000

Reexamination Certificate

active

10866148

ABSTRACT:
Methods, systems, and apparatuses are described for expanding an area of a semiconductor wafer, an enhancing die transfer capability. A wafer is attached to a support structure. The wafer is separated on the support structure into a plurality of dies. An area of the support structure is increased to increase a space between adjacent dies of the plurality of dies. Dies may be transferred from the expanded support structure.

REFERENCES:
patent: 3724737 (1973-04-01), Bodnar
patent: 3891157 (1975-06-01), Justus
patent: 3989575 (1976-11-01), Davies et al.
patent: 4346514 (1982-08-01), Makizawa et al.
patent: 4480742 (1984-11-01), Muylle
patent: 4925808 (1990-05-01), Richardson
patent: 5519381 (1996-05-01), Marsh et al.
patent: 5528222 (1996-06-01), Moskowitz et al.
patent: 5537105 (1996-07-01), Marsh et al.
patent: 5557280 (1996-09-01), Marsh et al.
patent: 5564888 (1996-10-01), Doan
patent: 5566441 (1996-10-01), Marsh et al.
patent: 5585193 (1996-12-01), Josephy et al.
patent: 5618759 (1997-04-01), Boysel
patent: 5725728 (1998-03-01), Fuke et al.
patent: 5837349 (1998-11-01), Van Erden et al.
patent: 5904546 (1999-05-01), Wood et al.
patent: 5946198 (1999-08-01), Hoppe et al.
patent: 5982284 (1999-11-01), Baldwin et al.
patent: 6018299 (2000-01-01), Eberhardt
patent: 6082660 (2000-07-01), Meyer
patent: 6091332 (2000-07-01), Eberhardt et al.
patent: 6145901 (2000-11-01), Rich
patent: 6147662 (2000-11-01), Grabau et al.
patent: 6165386 (2000-12-01), Endo et al.
patent: 6189591 (2001-02-01), Ariye et al.
patent: 6206292 (2001-03-01), Robertz et al.
patent: 6215194 (2001-04-01), Nakabayashi
patent: 6262692 (2001-07-01), Babb
patent: 6265977 (2001-07-01), Vega et al.
patent: 6281795 (2001-08-01), Smith et al.
patent: 6303462 (2001-10-01), Gidon
patent: 6322903 (2001-11-01), Siniaguine et al.
patent: 6416608 (2002-07-01), Mynott et al.
patent: 6451154 (2002-09-01), Grabau et al.
patent: 6514790 (2003-02-01), Plettner et al.
patent: 6534386 (2003-03-01), Irie
patent: 6606247 (2003-08-01), Credelle et al.
patent: 6608370 (2003-08-01), Chen et al.
patent: 6731353 (2004-05-01), Credelle et al.
patent: 6879029 (2005-04-01), Ueda et al.
patent: 2001/0016400 (2001-08-01), Lee
patent: 2003/0136503 (2003-07-01), Green et al.
patent: 2004/0020037 (2004-02-01), Arneson et al.
patent: 2004/0020040 (2004-02-01), Arneson et al.
patent: 196 34 473 (1998-01-01), None
patent: 198 05 031 (1999-08-01), None
patent: 198 40 226 (2000-03-01), None
patent: 2 775 533 (1999-09-01), None
patent: WO 00/14733 (2000-03-01), None
patent: WO 01/54058 (2001-07-01), None
patent: WOX 01/61646 (2001-08-01), None
patent: WO 01/95241 (2001-12-01), None
patent: WO 02/37414 (2002-05-01), None
patent: WO 02/49093 (2002-06-01), None
patent: WO 02/082368 (2002-10-01), None
English Language Abstract for DE 19634473, published Jan. 22, 1998, i page.
English Langauage Abstract for DE 19805031, published Aug. 19, 1999, 1 page.
English Language Abstract for DE 19840226, published Mar. 16, 2000, 1 page.
English Language Abstract for FR 2775533, published Sep. 3, 1999. 1 page.
Sarma, Sanjay, “White Paper-Towards the 5¢ Tag”, Auto-ID Center, Published Nov. 1, 2001, pp. 1-19.

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