Production method for a multilayer ceramic substrate

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S846000, C029S850000, C029S851000, C156S001000, C156S089170, C156S252000, C156S253000, C174S256000, C174S259000, C257S741000, C257S758000

Reexamination Certificate

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11059585

ABSTRACT:
An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of flexibility in design and make the multilayer ceramic substrate compact in size. A multilayer ceramic substrate in accordance with the invention is formed of a plurality of laminated ceramic substrates including such a composite ceramic substrate of different materials that is made by inserting the second ceramic substrate in a pounched-out portion made in the first ceramic substrate and by planarizing its top and bottom surfaces, wherein a conductive layer is formed in a portion across a boundary between the first ceramic substrate and the second ceramic substrate of the interface of the composite ceramic substrate of different materials.

REFERENCES:
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patent: 2004-148610 (2004-05-01), None

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