Supporting frame for surface-mount diode package

Details Supporting frame for surface-mount diode package Supporting frame for surface-mount diode package

2007-03-20

2007-03-20

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257SE23037, C257SE23039, C257SE23048, C257SE33057, C257SE33059, C257SE33066, C257S431000, C257S432000, C257S433000, C257S434000, C257S099000, C257S730000, C257S100000, C257S116000, C257S796000, C257S680000, C257S673000

Reexamination Certificate

active

11199925

ABSTRACT:
A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chip. wherein said supporting forms a cantilever over said first metallic contact and the overhanging end of the cantilever is glued to said second metallic contact.

REFERENCES:
patent: 5060117 (1991-10-01), Dorlanne et al.
patent: 5398166 (1995-03-01), Yonezawa et al.
patent: 5673730 (1997-10-01), Hamilton
patent: 6274924 (2001-08-01), Carey et al.
patent: 6414415 (2002-07-01), Shibutani et al.
patent: 6614103 (2003-09-01), Durocher et al.
patent: 2002/0076849 (2002-06-01), Wang et al.
patent: 2003/0116838 (2003-06-01), Wu
patent: 2003/0201542 (2003-10-01), Wu

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