Pump, electronic apparatus, and cooling system

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C417S353000, C361S698000, C257S714000, C165S080400, C165S121000, C165S104330

Reexamination Certificate

active

11103374

ABSTRACT:
The present invention provides a cooling pump, an electronic apparatus, and a cooling system in which positioning between a heat generating unit and a cooling pump can be achieved easily. The cooling pump according to the invention includes: a rotor having a disk-shaped member fixed to a revolving shaft, impellers for pressurizing liquid coolant provided on the disk-shaped member, a plurality of permanent magnets disposed into a ring shape disposed on and fixed to the disk-shaped member; a case including a pump chamber for rotatably accommodating rotor, an inlet port and a discharge port for the liquid coolant, and a heat receiving portion for the a heat generating unit which corresponds to part of the side wall of the pump chamber; a cover that closes the case in a liquid-tight manner and is formed with a recess, a stator stored in the recess of the cover for generating revolving magnetic field by a plurality of electromagnets and providing torque about the revolving shaft to the rotor; and a positioning member joined to the heat receiving portion for positioning with respect to the a heat generating unit.

REFERENCES:
patent: 5089936 (1992-02-01), Kojima et al.
patent: 5268817 (1993-12-01), Miyagawa et al.
patent: 5594619 (1997-01-01), Niyagawa et al.
patent: 5648889 (1997-07-01), Bosli
patent: 5731952 (1998-03-01), Ohgami et al.
patent: 5901035 (1999-05-01), Foster et al.
patent: 6005767 (1999-12-01), Ku et al.
patent: 6026888 (2000-02-01), Moore
patent: 6049459 (2000-04-01), Edmonds et al.
patent: 6141214 (2000-10-01), Ahn
patent: 6148906 (2000-11-01), Li et al.
patent: 6166907 (2000-12-01), Chien
patent: 6196850 (2001-03-01), Dietz et al.
patent: 6231371 (2001-05-01), Helot
patent: 6282082 (2001-08-01), Armitage et al.
patent: 6296048 (2001-10-01), Sauer
patent: 6313990 (2001-11-01), Cheon
patent: 6327145 (2001-12-01), Lian et al.
patent: 6333847 (2001-12-01), Katsui et al.
patent: 6377452 (2002-04-01), Sasaki et al.
patent: 6396687 (2002-05-01), Sun et al.
patent: 6408937 (2002-06-01), Roy
patent: 6418017 (2002-07-01), Patel et al.
patent: 6430038 (2002-08-01), Helot et al.
patent: 6437973 (2002-08-01), Helot et al.
patent: 6464195 (2002-10-01), Hildebrandt
patent: 6473296 (2002-10-01), Amemiya et al.
patent: 6477871 (2002-11-01), Shaw et al.
patent: 6483445 (2002-11-01), England
patent: 6519143 (2003-02-01), Goko
patent: 6519147 (2003-02-01), Nakagawa et al.
patent: 6519148 (2003-02-01), Nakagawa et al.
patent: 6532152 (2003-03-01), White et al.
patent: 6594149 (2003-07-01), Yamada et al.
patent: 6625022 (2003-09-01), Frutschy et al.
patent: 6625024 (2003-09-01), Mermet-Guyennet
patent: 6652223 (2003-11-01), Horng et al.
patent: 6654234 (2003-11-01), Landry et al.
patent: 6668911 (2003-12-01), Bingler
patent: 6717798 (2004-04-01), Bell et al.
patent: 6728102 (2004-04-01), Ishikawa et al.
patent: 6755626 (2004-06-01), Komatsu et al.
patent: 6768637 (2004-07-01), Amemiya
patent: 6774870 (2004-08-01), Mead, Jr. et al.
patent: 6785128 (2004-08-01), Yun
patent: 6804115 (2004-10-01), Lai
patent: 6808371 (2004-10-01), Niwatsukino et al.
patent: 6809927 (2004-10-01), Ohashi et al.
patent: 6809930 (2004-10-01), Mueller et al.
patent: 6829139 (2004-12-01), Duarte
patent: 6839234 (2005-01-01), Niwatsukino et al.
patent: 6856506 (2005-02-01), Doherty et al.
patent: 6873521 (2005-03-01), Landry et al.
patent: 6894899 (2005-05-01), Wu et al.
patent: 6924978 (2005-08-01), DiStefano
patent: 6927978 (2005-08-01), Arai et al.
patent: 7016195 (2006-03-01), Ito et al.
patent: 7054158 (2006-05-01), Kimmich
patent: 7055581 (2006-06-01), Roy
patent: 7079394 (2006-07-01), Mok
patent: 7095614 (2006-08-01), Goldman
patent: 7124811 (2006-10-01), Crocker et al.
patent: 2002/0018337 (2002-02-01), Nakamura
patent: 2002/0053421 (2002-05-01), Hisano et al.
patent: 2002/0141159 (2002-10-01), Bloemen
patent: 2003/0039097 (2003-02-01), Igarashi
patent: 2003/0142474 (2003-07-01), Karidis et al.
patent: 2003/0214786 (2003-11-01), Niwatsukino et al.
patent: 2004/0001310 (2004-01-01), Chu et al.
patent: 2004/0027800 (2004-02-01), Tanimoto et al.
patent: 2004/0042176 (2004-03-01), Niwatsukino et al.
patent: 2004/0057197 (2004-03-01), Hill et al.
patent: 2005/0007739 (2005-01-01), Gata
patent: 2005/0052833 (2005-03-01), Tanaka et al.
patent: 2005/0068732 (2005-03-01), Tsuji
patent: 2005/0117298 (2005-06-01), Koga et al.
patent: 2005/0164624 (2005-07-01), Hisamatsu
patent: 0834795 (1998-04-01), None
patent: 07-049725 (1995-02-01), None
patent: 07-142886 (1995-06-01), None
patent: 08/046097 (1996-02-01), None
patent: 10-004161 (1998-01-01), None
patent: 10-055227 (1998-02-01), None
patent: 10-261884 (1998-09-01), None
patent: 10/303582 (1998-11-01), None
patent: 11-039058 (1999-02-01), None
patent: 11-166500 (1999-06-01), None
patent: 2000-049478 (2000-02-01), None
patent: 2001-057490 (2001-02-01), None
patent: 2001-230356 (2001-08-01), None
patent: 2001-251079 (2001-09-01), None
patent: 2002-099356 (2002-04-01), None
patent: 02002151638 (2002-05-01), None
patent: 2002-344186 (2002-11-01), None
patent: 2002-353670 (2002-12-01), None
patent: 2003-044169 (2003-02-01), None
patent: 2003-068317 (2003-03-01), None
patent: 2003-101272 (2003-04-01), None
patent: 2003-172286 (2003-06-01), None
patent: 2003-216278 (2003-07-01), None
patent: 2003-233441 (2003-08-01), None
patent: 2003-343492 (2003-12-01), None
patent: 2004-047921 (2004-02-01), None
patent: 3452059 (2004-02-01), None
patent: 3431024 (2004-08-01), None

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