Opto-electronic module form factor having adjustable optical...

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

Reexamination Certificate

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C385S088000

Reexamination Certificate

active

10621035

ABSTRACT:
An apparatus opto-electronic module that is flexible in design such that components of different types and dimensions can be incorporated into the module without straying from certain mechanical standards requirements is described. Generally, an opto-electronic module of the present invention includes a first substrate that supports an opto-electronic device and thereby the optical port, a second substrate that includes the electrical port, and a flexible connector that electrically connects the first and second substrates. The flexible connector allows for the first substrate and the second substrate to be positioned in various orientations with respect to each other so that optical and electrical components of various sizes can be utilized and still remain in compliance with a set of mechanical standards.

REFERENCES:
patent: 4152711 (1979-05-01), Nakata
patent: 5011246 (1991-04-01), Corradetti et al.
patent: 5019673 (1991-05-01), Juskey et al.
patent: 5054870 (1991-10-01), Losch et al.
patent: 5076688 (1991-12-01), Bowen et al.
patent: 5139969 (1992-08-01), Mori
patent: 5208879 (1993-05-01), Gallo et al.
patent: 5325455 (1994-06-01), Henson et al.
patent: 5349317 (1994-09-01), Notani et al.
patent: 5352926 (1994-10-01), Andrews
patent: 5487124 (1996-01-01), Bowen et al.
patent: 5515467 (1996-05-01), Webb
patent: 5521992 (1996-05-01), Chun et al.
patent: 5535296 (1996-07-01), Uchida
patent: 5579208 (1996-11-01), Honda et al.
patent: 5590232 (1996-12-01), Wentworth et al.
patent: 5608262 (1997-03-01), Degani et al.
patent: 5621837 (1997-04-01), Yamada et al.
patent: 5723369 (1998-03-01), Barber
patent: 5726079 (1998-03-01), Johnson
patent: 5744827 (1998-04-01), Jeong et al.
patent: 5768456 (1998-06-01), Knapp et al.
patent: 5774616 (1998-06-01), Matsuda
patent: 5780875 (1998-07-01), Tsuji et al.
patent: 5790384 (1998-08-01), Ahmad et al.
patent: 5798567 (1998-08-01), Kelly et al.
patent: 5821615 (1998-10-01), Lee
patent: 5864642 (1999-01-01), Chun et al.
patent: 5896479 (1999-04-01), Vladic
patent: 5933558 (1999-08-01), Sauvageau et al.
patent: 5949135 (1999-09-01), Washida et al.
patent: 6027254 (2000-02-01), Yamada et al.
patent: 6030246 (2000-02-01), Kunishi
patent: 6043430 (2000-03-01), Chun
patent: 6054759 (2000-04-01), Nakamura
patent: 6075284 (2000-06-01), Choi et al.
patent: 6086263 (2000-07-01), Selli et al.
patent: 6201704 (2001-03-01), Poplawski et al.
patent: 6236109 (2001-05-01), Hsuan et al.
patent: 6239427 (2001-05-01), Mizue
patent: 6258630 (2001-07-01), Kawahara
patent: 6281568 (2001-08-01), Glenn et al.
patent: 6305848 (2001-10-01), Gregory
patent: 6316837 (2001-11-01), Song
patent: 6316838 (2001-11-01), Ozawa et al.
patent: 6318902 (2001-11-01), Igl et al.
patent: 6318909 (2001-11-01), Giboney et al.
patent: 6356686 (2002-03-01), Kuczynski
patent: 6364542 (2002-04-01), Deane et al.
patent: 6450704 (2002-09-01), O'Connor et al.
patent: 6497518 (2002-12-01), Deane
patent: 6583902 (2003-06-01), Yuen
patent: 6595699 (2003-07-01), Nguyen et al.
patent: 6599033 (2003-07-01), Pohnke
patent: 6619858 (2003-09-01), Lytel et al.
patent: 6624507 (2003-09-01), Nguyen et al.
patent: 6635866 (2003-10-01), Chan et al.
patent: 6655854 (2003-12-01), Nguyen et al.
patent: 6702480 (2004-03-01), Sparacino
patent: 6703561 (2004-03-01), Rosenberg et al.
patent: 6707140 (2004-03-01), Nguyen et al.
patent: 6792171 (2004-09-01), Hargis et al.
patent: 6821027 (2004-11-01), Lee et al.
patent: 6916121 (2005-07-01), Mazotti et al.
patent: 6923580 (2005-08-01), Ohno et al.
patent: 2001/0013645 (2001-08-01), King et al.
patent: 2001/0048151 (2001-12-01), Chun
patent: 2002/0136502 (2002-09-01), Bachl et al.
patent: 2003/0026081 (2003-02-01), Liu et al.
patent: 2003/0026556 (2003-02-01), Liu et al.
patent: 2003/0169980 (2003-09-01), Yang
patent: 2003/0201462 (2003-10-01), Pommer et al.
patent: 2004/0091208 (2004-05-01), Doi
patent: 60-202956 (1985-10-01), None
patent: 08125066 (1996-05-01), None
Nguyen et al., “Techniques for Attaching Rotated Photonic Devices to an Optical Sub-Assembly in an Optoelectronic Package,” U.S. Appl. No. 10/165,458, filed Jun. 6, 2002, 31 Pages.
S. Savastiouk, PH.D., et al. “3-D stacked wafer-level packaging”, Mar. 2000,Advanced Packaging, pp. 28-34.
National Semiconductor, “Packaging Databook”,1993 National Semiconductor, pp. v-xi to 1-3 to 1-4, 3-1 to 3-20, 3-30 to 3-31, 3-62 to 3-69. Please note: The year of publication is sufficiently earlier than the effective U.S. filing date so that the particular month of publication is not in issue.

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