Soldering a flexible circuit

Details Soldering a flexible circuit Soldering a flexible circuit

2007-07-31

2007-07-31

Luu, Matthew (Department: 2861)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S050000, C029S025350

Reexamination Certificate

active

10950284

ABSTRACT:
Techniques are provided for controlling solder flow in applications where a flexible circuit is soldered to a microelectromechanical structure. A metal layer is formed on a substrate. A solder mask is formed on the metal layer such that portions of the metal layer are covered by the mask and portions are left exposed. A flexible circuit is soldered to the metal layer in at least some of the areas where the metal layer is exposed.

REFERENCES:
patent: 4530464 (1985-07-01), Yamamoto et al.
patent: 5779971 (1998-07-01), Tsung Pan et al.
patent: 6593220 (2003-07-01), Yu et al.
patent: 6840601 (2005-01-01), Miyata
patent: 6979074 (2005-12-01), Watanabe et al.
patent: 7040002 (2006-05-01), Castiglioni et al.
patent: 2002/0130928 (2002-09-01), Kondo et al.
patent: 2003/0214564 (2003-11-01), Miyata
patent: 2004/0040742 (2004-03-01), Ishizaki
patent: 2004/0113994 (2004-06-01), Shinkai
patent: 0 974 465 (2000-01-01), None
patent: 1 245 390 (2002-10-01), None
Xiao et al., “A pressure sensor using flip-chip on low-cost flexible substrate”, May 29, 2001, 2001 Proceeding 51stElectronic Components and Technology Conference, New York, NY, pp. 750-754.
International Search Report and Written Opinion of the International Searching Authority, International Application Serial No. PCT/US2005/034181, Jan. 20, 2006, 9 pp.

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