Heat dissipating device for an integrated circuit chip

Details Heat dissipating device for an integrated circuit chip Heat dissipating device for an integrated circuit chip

2007-05-22

2007-05-22

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S707000, C257S717000, C257S718000, C257S719000, C165S080300

Reexamination Certificate

active

11269961

ABSTRACT:
An electronic assembly comprises a support board, an integrated circuit chip interconnected and coupled to the support board, and a thermal-gap-filler pad placed over the integrated circuit chip and in contact with an external device to dissipate heat generated by the integrated circuit chip. The electronic assembly further comprises a standoff structure disposed adjacent the thermal-gap-filler pad and coupled to the support board, the standoff structure configured to prevent excessive force from being applied onto the thermal-gap-filler.

REFERENCES:
patent: 5621615 (1997-04-01), Dawson et al.
patent: 5706171 (1998-01-01), Edwards et al.
patent: 5710459 (1998-01-01), Teng et al.
patent: 5787576 (1998-08-01), Warren et al.
patent: 5985697 (1999-11-01), Chaney et al.
patent: 6025991 (2000-02-01), Saito
patent: 6218730 (2001-04-01), Toy et al.
patent: 6301107 (2001-10-01), Lev et al.
patent: 6496373 (2002-12-01), Chung
patent: 6562655 (2003-05-01), Glenn et al.
patent: 6570764 (2003-05-01), Bhatia et al.
patent: 6657296 (2003-12-01), Ho et al.
patent: 6706562 (2004-03-01), Mahajan et al.
patent: 6740972 (2004-05-01), Smith et al.
patent: 6750551 (2004-06-01), Frutschy et al.
patent: 6767765 (2004-07-01), Chiu
patent: 6836408 (2004-12-01), Gektin et al.
patent: 6837306 (2005-01-01), Houle et al.
patent: 6870246 (2005-03-01), Mullen et al.
patent: 6891259 (2005-05-01), Im et al.
patent: 6936919 (2005-08-01), Chuang et al.
patent: 7023699 (2006-04-01), Glovatsky et al.
patent: 2001/0033476 (2001-10-01), Dibene et al.
patent: 2002/0105071 (2002-08-01), Mahajan et al.
patent: 2003/0085453 (2003-05-01), Eyman et al.
patent: 2003/0117775 (2003-06-01), Vrtis et al.
patent: 2003/0122242 (2003-07-01), Takeuchi
patent: 2004/0095727 (2004-05-01), Houle
patent: 2004/0164402 (2004-08-01), Yoshimura
patent: 2004/0218354 (2004-11-01), Lee et al.
patent: 2006/0043553 (2006-03-01), Yang et al.

Affiliated with

Also associated with

Rating

Heat dissipating device for an integrated circuit chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipating device for an integrated circuit chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating device for an integrated circuit chip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3735018