Method of forming a support frame for semiconductor packages

Details Method of forming a support frame for semiconductor packages Method of forming a support frame for semiconductor packages

2007-09-18

2007-09-18

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Electron emitter manufacture

C257S433000

Reexamination Certificate

active

11156732

ABSTRACT:
A semiconductor die package having an elastomeric substrate with a first support frame and a second support frame. The first support frame has a cavity within which a semiconductor die is placed. The second support frame may have an optional cavity. The optional cavity in the second support frame may have an optional rigid structure. The rigid structure may have a heating element formed within it.

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