Chip package with capacitor

Details Chip package with capacitor Chip package with capacitor

2007-07-24

2007-07-24

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE25013, C257SE25011, C257SE25030, C257SE23004, C257SE23067, C257SE23069, C257SE23079, C257S777000, C257S675000, C257S723000, C257S784000, C257S737000, C257S738000, C257S778000, C257S773000, C257S528000, C257S532000, C257S724000, C257S691000, C257S698000

Reexamination Certificate

active

09573955

ABSTRACT:
A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window to the printed circuit board by solder connections, locating a suspended semiconductor chip within the window, and connecting the suspended semiconductor chip to one or more primary chips overlying the window in a chip-on-chip connection. A bypass capacitor is formed on the printed circuit board.

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