Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2007-07-03
2007-07-03
Nguyen, Ha Tran (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C257S686000
Reexamination Certificate
active
11193465
ABSTRACT:
A stack type semiconductor apparatus package includes: (i) a first circuit substrate, (ii) a semiconductor apparatus package mounted on the first circuit substrate, (iii) a semiconductor apparatus, and (iv) a sealing resin for covering them. The first circuit substrate has a surface on which first connecting pads and second connecting pads are provided. The first connecting pads are connected to first external input/output terminals of the semiconductor apparatus package, and the second connecting pads are connected to electrodes of the first semiconductor apparatus, respectively. On a rear surface of the first circuit substrate, there are provided second external input/output terminals connected to the first connecting pads and the second connecting pads. The semiconductor apparatus package includes: a second circuit substrate, and a second semiconductor apparatus mounted on the second circuit substrate. On a surface of the second circuit substrate, there are provided third connecting pads connected to electrodes of the second semiconductor apparatus, respectively. The first external input/output terminals are provided on a rear surface of the second circuit substrate. This makes it possible to provide a stack type semiconductor apparatus package that can be easily manufactured with inexpensive cost.
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patent: 6642610 (2003-11-01), Park et al.
patent: 6930378 (2005-08-01), St. Amand et al.
patent: 7087989 (2006-08-01), Nakayama
patent: 11-219984 (1999-08-01), None
patent: 2003-234451 (2003-08-01), None
Nguyen Ha Tran
Nguyen Tung X.
Nixon & Vanderhye P.C.
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