Stack type semiconductor apparatus package and manufacturing...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S686000

Reexamination Certificate

active

11193465

ABSTRACT:
A stack type semiconductor apparatus package includes: (i) a first circuit substrate, (ii) a semiconductor apparatus package mounted on the first circuit substrate, (iii) a semiconductor apparatus, and (iv) a sealing resin for covering them. The first circuit substrate has a surface on which first connecting pads and second connecting pads are provided. The first connecting pads are connected to first external input/output terminals of the semiconductor apparatus package, and the second connecting pads are connected to electrodes of the first semiconductor apparatus, respectively. On a rear surface of the first circuit substrate, there are provided second external input/output terminals connected to the first connecting pads and the second connecting pads. The semiconductor apparatus package includes: a second circuit substrate, and a second semiconductor apparatus mounted on the second circuit substrate. On a surface of the second circuit substrate, there are provided third connecting pads connected to electrodes of the second semiconductor apparatus, respectively. The first external input/output terminals are provided on a rear surface of the second circuit substrate. This makes it possible to provide a stack type semiconductor apparatus package that can be easily manufactured with inexpensive cost.

REFERENCES:
patent: 6157080 (2000-12-01), Tamaki et al.
patent: 6642610 (2003-11-01), Park et al.
patent: 6930378 (2005-08-01), St. Amand et al.
patent: 7087989 (2006-08-01), Nakayama
patent: 11-219984 (1999-08-01), None
patent: 2003-234451 (2003-08-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Stack type semiconductor apparatus package and manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stack type semiconductor apparatus package and manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stack type semiconductor apparatus package and manufacturing... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3732824

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.