Polishing pad of CMP equipment for polishing a semiconductor...

Details Polishing pad of CMP equipment for polishing a semiconductor... Polishing pad of CMP equipment for polishing a semiconductor...

2007-01-09

2007-01-09

Morgan, Eileen P. (Department: 3723)

Abrading

Machine

Rotary tool

C451S287000, C451S530000, C451S533000

Reexamination Certificate

active

10866805

ABSTRACT:
A polishing pad used for polishing the surface of a semiconductor wafer in CMP equipment, includes a support layer adhered to the top of a rotary plate of the CMP equipment, a polishing layer disposed on top of the support layer, and an adhesive layer interposed between the support layer and the polishing layer and adhesively fixing the polishing layer to the support layer. In one embodiment, the polishing support layer is a plate-shaped molded article formed of a mixture including magnetic powder and a bonding agent containing synthetic resin. In another embodiment, a protective film extends along outer peripheral side walls of the adhesive layer and the support layer.

REFERENCES:
patent: 3571984 (1971-03-01), Koorneef et al.
patent: 6045439 (2000-04-01), Birang et al.
patent: 6077153 (2000-06-01), Fujita et al.
patent: 6454630 (2002-09-01), Tolles
patent: 6458023 (2002-10-01), Moon
patent: 6561889 (2003-05-01), Xu et al.
patent: 6855034 (2005-02-01), Hasegawa
patent: 2001/0036805 (2001-11-01), Birang et al.

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