Heat sink made from a singly extruded heatpipe

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

Reexamination Certificate

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Details

C165S080300

Reexamination Certificate

active

11000583

ABSTRACT:
A heatpipe for cooling an integrated circuit. The heatpipe includes a pipe and radial fins that are formed by extruding a single piece of material, such as heat conducting metal. Each of the radial fins extends away from the pipe and runs (preferably) the length of the pipe. Each radial fin has normally oriented subfins that provide additional heat convection surface areas to the radial fins. Within the pipe are interior fins, also formed during the material extrusion process. The interior fins provide additional conduction cooling to a heat transferring fluid circulating within the pipe.

REFERENCES:
patent: 3182114 (1965-05-01), Burgess et al.
patent: 4116266 (1978-09-01), Sawata et al.
patent: 4588023 (1986-05-01), Munekawa
patent: 6535385 (2003-03-01), Lee
patent: 6633484 (2003-10-01), Lee et al.
patent: 6657862 (2003-12-01), Crocker et al.
patent: 2001/0048397 (2001-12-01), Smith
patent: 2003/0066628 (2003-04-01), Mochizuki et al.
patent: 2003/0131970 (2003-07-01), Carter et al.
patent: 2003/0192671 (2003-10-01), Lee et al.
patent: 0 612 617 (1994-08-01), None
patent: 3-156294 (1991-04-01), None

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