Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-03-06
2007-03-06
Chang, Richard (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S854000, C029S740000, C029S739000, C428S071000, C428S075000, C257S726000, C257S727000
Reexamination Certificate
active
10929168
ABSTRACT:
A method of improving shock and vibration isolation of a CGA integrated package which utilizes solder column grid arrays and that includes a substrate and a package lid, includes providing a support frame attached at an attachment point to the substrate or the package lid and at a second attachment point to the circuit board. Isolation material is provided at the attachment point of the support frame to the substrate or package lid, or at the second attachment point of the support frame to the circuit board.
REFERENCES:
patent: 4164003 (1979-08-01), Cutchaw
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4581680 (1986-04-01), Garner
patent: 4886571 (1989-12-01), Suzuki et al.
patent: 5222014 (1993-06-01), Lin
patent: 5239198 (1993-08-01), Lin et al.
patent: 5244143 (1993-09-01), Ference et al.
patent: 5426405 (1995-06-01), Miller et al.
patent: 5541450 (1996-07-01), Jones et al.
patent: 5557503 (1996-09-01), Isaacs et al.
patent: 5615735 (1997-04-01), Yoshida et al.
patent: 5805427 (1998-09-01), Hoffman
patent: 5833471 (1998-11-01), Selna
patent: 5905636 (1999-05-01), Baska et al.
patent: 5926370 (1999-07-01), Cromwell et al.
patent: 5956576 (1999-09-01), Toy et al.
patent: 5958556 (1999-09-01), McCutcheon
patent: 5978229 (1999-11-01), Kim
patent: 5990418 (1999-11-01), Bivona et al.
patent: 6061235 (2000-05-01), Cromwell et al.
patent: 6084178 (2000-07-01), Cromwell et al.
patent: 6198630 (2001-03-01), Cromwell et al.
patent: 6231333 (2001-05-01), Gruber et al.
patent: 6235996 (2001-05-01), Farooq et al.
patent: 6276596 (2001-08-01), Gruber et al.
patent: 6499215 (2002-12-01), Hoffmeyer et al.
Thomas P. Dolbear et al., Effect of Mechanical Shock and Vibration on the Second-level Temperature Cycling Reliability of Ceramic Ball Grid Arrays with a Continuous Compressive Load Applied, 5 unnumbered pages.
R. Bargerhuff et al., Development of a Large Heatsink Support Structure, 12 unnumbered pages.
Jeffrey L. Deeney et al., patent application filed on Nov. 16, 2001 titled Method And Apparatus of Supporting Circuit Component Having A Solder Column Array Using Interspersed Rigid Columns, pp. 1-9 and 1 sheet of drawings.
Jeffrey L. Deeney, patent application filed on Nov. 16, 2001 titled Method And Apparatus For Supporting Circuit Component Having Solder Column Array Interconnects Using Interposed Support Shims, pp. 1-13 and 1 sheet of a drawing.
Jeffrey L. Deeney et al., patent application filed on Nov. 16, 2001 titled Method And Apparatus For Supporting A Circuit Component Having A Solder Column Interconnects Using An External Support, pp. 1-15 and 2 sheets of drawings.
Augustin Thomas J.
Malone Christopher G.
Chang Richard
Hewlett--Packard Development Company, L.P.
LandOfFree
Method of a supporting a CGA integrated package on a circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of a supporting a CGA integrated package on a circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of a supporting a CGA integrated package on a circuit... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3728538