Solder bearing terminal

Geometrical instruments

Patent

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Details

H01R 1106

Patent

active

041205588

ABSTRACT:
A terminal clip for attachment to a contact pad on a substrate having an individual mass of solder mechanically engaged with the clip in a position to be melted for bonding the clip to the contact pad.

REFERENCES:
patent: 3351704 (1967-11-01), Sitzler
patent: 4019803 (1977-04-01), Schell

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