Method of manufacturing a high-frequency coil device

Details Method of manufacturing a high-frequency coil device Method of manufacturing a high-frequency coil device

2007-05-15

2007-05-15

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S602100, C029S603230, C029S831000, C029S832000, C029S837000, C336S065000, C336S083000, C336S090000, C336S200000, C336S206000, C336S174000

Reexamination Certificate

active

11218812

ABSTRACT:
In a high-frequency coil device having small dispersion in coil inductance and suitable for use in GHz band and a method of manufacturing the high-frequency coil device, a spirally-shaped fine-pitch coil is embedded in the surface of a polyimide layer as a dielectric substrate so that the bottom surface and side surface of the coil is covered by the polyimide layer. The spirally-shaped coil has an Ni—Cu laminate structure in which an Ni plating layer and a Cu plating layer are laminated, and also the side surface thereof is made substantially vertical while the width thereof is uniform with high precision. The surface of the spirally-shaped coil, that is, the surface of the Ni plating layer serving as the upper layer is coated with an Au plating layer.

REFERENCES:
patent: 6413651 (2002-07-01), Yan et al.
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patent: 06334507 (1994-12-01), None
patent: 09069457 (1997-03-01), None
“RF front end for a 4.1 Tesla clinical NMR spectrometer”; Vaughan, J.T.; Haupt, D.N.; Noa, P.J.; Vaughn, J.M.; Pohost, G.M.; Nuclear Science, IEEE Transactions on vol. 42, Issue 4, Part 1-2, Aug. 1995 pp. 1333-1337.

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