Multilayer wiring board, method of mounting components, and...

Details Multilayer wiring board, method of mounting components, and... Multilayer wiring board, method of mounting components, and...

2007-01-23

2007-01-23

Vigushin, John B. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S764000, C361S783000, C257S432000, C257S434000, C257S700000, C438S064000, C438S065000, C438S116000

Reexamination Certificate

active

10845570

ABSTRACT:
A multilayer wiring board on which multiple components are overlappingly mounted. The multilayer wiring board includes: a first surface on which a first component among the multiple components is mounted; and a second surface whose height in a thickness direction of the multilayer wiring board is smaller than that of the first surface, by which a step is provided between the first surface and the second surface, a second component among the multiple components being mounted on the second surface to partially overlap the first component in a non-contact manner, the second surface also having a light-transmitting window through which light is transmitted.

REFERENCES:
patent: 5200631 (1993-04-01), Austin et al.
patent: 5652462 (1997-07-01), Matsunaga et al.
patent: 5763943 (1998-06-01), Baker et al.
patent: 5901046 (1999-05-01), Ohta et al.
patent: 6384473 (2002-05-01), Peterson et al.
patent: 6459161 (2002-10-01), Hirata et al.
patent: 2002/0096753 (2002-07-01), Tu et al.

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