Magnetic sensor

Electricity: measuring and testing – Magnetic – Magnetometers

Reexamination Certificate

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Reexamination Certificate

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11529320

ABSTRACT:
The magnetic sensor is fabricated such that a magnetic sensor chip, having a one-chip structure in which MRE bridges and a comparator are included, is mounted onto a lead frame using an adhesive material, and then the magnetic sensor chip mounted on the lead frame is encapsulated by molding in a molded material. The magnetic sensor includes a magnetic-field generating portion formed by magnetizing at least one of the chip mounting member, the adhesive material, and the encapsulating material.

REFERENCES:
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patent: A-H10-270160 (1998-10-01), None
patent: A-2001-267164 (2001-09-01), None
Notice of Official Rejection from Japanese Patent Office issued on Dec. 19, 2006 for the corresponding Japaense patent application No. 2003-055823 (a copy and English translation thereof).
Office Action from United States Patent Office issued on Nov. 22, 2006 for the corresponding U.S. Appl. No. 10/790,040 (a copy thereof).
Notification of Preliminary Rejection from Korean Patent Office issued on Sep. 23, 2005 for the corresponding Korean patent application No. 10-2004-0014089 (a copy and English translation thereof).
First Office from Chinese Patent Office issued on Nov. 4, 2005 for the corresponding Chinese patent No. 200410007404.X (a copy and English translation thereof).
Second Office Action from Chinese Patent Office issued on Apr. 21, 2006 for the corresponding Chinese patent application No. 200410007404.X (a copy and English translation thereof).

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