Measuring and testing – Vibration – Vibrator
Reexamination Certificate
2007-09-18
2007-09-18
Williams, Hezron (Department: 2856)
Measuring and testing
Vibration
Vibrator
C073S778000
Reexamination Certificate
active
10997008
ABSTRACT:
A method and apparatus for simultaneous fracture and fatigue testing of a semiconductor wafer which includes installing an array of cantilever beams on the wafer, wherein each of the cantilever beams includes a proof mass; mounting the wafer on a base; actuating the base at a predetermined rate of motion causing a displacement of the proof mass; and measuring the displacement. The actuating causes the array to oscillate in a direction perpendicular to the wafer, wherein the displacement of the proof mass is generally perpendicular to a plane of the wafer. Alternatively, the actuating causes the array to rotate around a center of the array, wherein the displacement of the proof mass is generally parallel to a plane of the wafer. The displacement is a function of mechanical stress and strain in the cantilever beams, wherein the mechanical stress and strain causes any of fracture and fatigue of the cantilever beams.
REFERENCES:
patent: 3187566 (1965-06-01), Coombs
patent: 4603587 (1986-08-01), Kimball et al.
patent: 5014000 (1991-05-01), Schlagheck
patent: 5528151 (1996-06-01), Perez
patent: 6053034 (2000-04-01), Tsui et al.
patent: 6424165 (2002-07-01), de Boer et al.
patent: 6817255 (2004-11-01), Haque et al.
Miller Rose M.
Stolarun Edward L.
United States of America as represented by the Secretary of the
Williams Hezron
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