Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-04-03
2007-04-03
Lee, Hsien-Ming (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S107000, C438S455000, C438S637000
Reexamination Certificate
active
11033304
ABSTRACT:
In a semiconductor-device fabrication method, a plurality of recessed portions are first formed in the principal surface of a substrate. Then, a through hole, passing through the substrate in the front-to-back direction of the substrate, is formed under a portion of the bottom of each recessed portion in the substrate. Subsequently, a plurality of semiconductor elements in the form of chips are spread in a liquid, and the semiconductor-element-spread liquid is poured over the principal surface of the substrate, while passing the liquid through the through holes, so that the semiconductor elements fit into the recessed portions in a self-aligned manner. In this way, the semiconductor elements are disposed into the recessed portions in the substrate in a self-aligned manner.
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Lee Hsien-Ming
McDermott Will & Emery LLP
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