Memory stacking system and method

Details Memory stacking system and method Memory stacking system and method

2007-09-11

2007-09-11

Phan, Trong (Department: 2827)

Static information storage and retrieval

Hardware for storage elements

C365S189080, C365S225700, C365S230030

Reexamination Certificate

active

11413793

ABSTRACT:
A method of forming a stacked memory module from a plurality of memory devices is provided. Each of the plurality of memory devices is modified to include a logic block for decoding a plurality of chip select signals. A first high density memory module is also provided that includes the modified memory devices and a serial presence detect device. The first high density memory module is included within an electronic system. Also, an additional method of forming a stacked memory module is provided, the method requiring modification of an address buffer to include a logic block for decoding a plurality of chip select signals. A second high density memory module is also provided that includes the modified address buffer and a serial presence detect device. The second high density memory module is included within an electronic system.

REFERENCES:
patent: 4884237 (1989-11-01), Mueller et al.
patent: 5963464 (1999-10-01), Dell et al.
patent: 6278616 (2001-08-01), Gelsomini et al.
patent: 6298426 (2001-10-01), Ajanovic
patent: 6404662 (2002-06-01), Cady et al.
patent: 6633948 (2003-10-01), Pelissier et al.
patent: 6683372 (2004-01-01), Wong et al.
patent: 6765812 (2004-07-01), Anderson
patent: 6771526 (2004-08-01), LaBerge
patent: 6961281 (2005-11-01), Wong et al.
PCT International Search Report dated Jan. 30, 2006 (4 pages).

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