Method for manufacturing a ceramic multilayer circuit board

Details Method for manufacturing a ceramic multilayer circuit board Method for manufacturing a ceramic multilayer circuit board

2007-03-06

2007-03-06

Mayes, Melvin C. (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S089160, C156S089170, C156S232000, C156S235000

Reexamination Certificate

active

10363904

ABSTRACT:
By increasing the quantity of resin binder of at least one of conductive paste and ceramic green sheet, adhesion between conductive film and the ceramic green sheet is improved when an intaglio filled with the conductive paste is hot pressed on the ceramic green sheet. As a result, transfer failure at intaglio transfer is removed and internal fracture of the ceramic green sheet is suppressed. Also, by coating an adhesive layer on an intaglio filled with conductive paste, adhesion with ceramic green sheet is improved and transfer failure at intaglio transfer is suppressed.

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