Packaged electroosmotic pumps using porous frits for cooling...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

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Details

C257SE23098, C257S706000, C257S707000, C257S712000, C257S686000, C361S764000, C361S704000, C062S259200

Reexamination Certificate

active

10669212

ABSTRACT:
An integrated electroosmotic pump may be incorporated in the same integrated circuit package with a re-combiner, and an integrated circuit chip to be cooled by fluid pumped by the electroosmotic pump.

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patent: 6942018 (2005-09-01), Goodson et al.
patent: 2003/0062149 (2003-04-01), Goodson et al.
patent: 2003/0164231 (2003-09-01), Goodson et al.

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