Method and apparatus for attaching multiple heat sinks to...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S080300, C165S185000, C257S719000, C361S715000

Reexamination Certificate

active

10934926

ABSTRACT:
A plurality of heat sinks in one example is coupled to a support structure. The support structure has a plurality of independent spring force elements that respectively contact the plurality of heat sinks such that each heat sink of the plurality of heat sinks is moveable within the support structure relative to the other heat sinks of the plurality of heat sinks. The support structure is coupled to a substrate having a plurality of components, each of the components having an upper surface, at least two of the upper surfaces being non-coplanar. The non-coplanar upper surfaces of the components are respectively coupled to the plurality of heat sinks by respective thermal interfaces.

REFERENCES:
patent: 5587882 (1996-12-01), Patel
patent: 6462951 (2002-10-01), Letourneau
patent: 6549411 (2003-04-01), Herbert
patent: 6724628 (2004-04-01), Franz et al.
patent: 6746270 (2004-06-01), Peterson et al.

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