Circuit structure of package substrate

Details Circuit structure of package substrate Circuit structure of package substrate

2007-03-20

2007-03-20

Quach, T. N. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S773000, C257SE23019

Reexamination Certificate

active

10905803

ABSTRACT:
A circuit structure for a package substrate or a circuit board is provided. The circuit structure has a dielectric layer with an upper surface and a lower surface, at least a first line and at least a second line. The first line is disposed on the dielectric layer on which a base of the first line is aligned with the upper surface. In addition, the second line is disposed on the dielectric layer on which a base of the second line is embedded below the upper surface. Since the second line is embedded into the dielectric layer, the distance with a reference plane is reduced and the crosstalk between the signals is further effectively reduced.

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