CMP conditioner

Details CMP conditioner CMP conditioner

2006-12-19

2006-12-19

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Accessory

Dressing

C451S444000, C451S548000

Reexamination Certificate

active

07150677

ABSTRACT:
A CMP conditioner is provided in which diamond grit that is adhered to a conditioning surface so as to face and be in contact with a polishing pad of a CMP apparatus is adhered such that 111 surfaces of crystal surfaces of the diamond grit are substantially parallel with the conditioning surface and face in a direction faced by the conditioning surface.

REFERENCES:
patent: 7044990 (2006-05-01), Ishizaki et al.
patent: 2002/0127962 (2002-09-01), Cho et al.
patent: 2004/0203325 (2004-10-01), Donohue
patent: 2001-71267 (2001-03-01), None
patent: 2002-273657 (2002-09-01), None
Patent Abstracts of Japan for JP2001-071267 published Mar. 21, 2001.
Patent Abstracts of Japan for JP2002-273657 published Sep. 25, 2002.

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