Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-10-10
2006-10-10
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S603230, C029S603240, C029S602100, C205S118000, C205S135000
Reexamination Certificate
active
07117583
ABSTRACT:
A method and apparatus using a pre-patterned seed layer for providing an aligned coil for an inductive head structure. The method uses an aligned process where the base plate imprint is fabricated on an electrically insulating layer and the reversed image is fabricated and etched into the coil insulation material, e.g., hard bake photoresist to alleviate the problems associated with complete ion removal of the seed layer between high aspect ratio coils. The method would also not be prone to plating non-uniformities (voids), and would not be subject to seed layer undercutting in a wet etch step process.
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“Process Application for the Production of Permalloy Structures in Thin Film Magnetic Heads,” IBM Technical Disclosure Bulletin, vol. 39, No. 6, Jun. 1996, pp. 195-197.
Dinan Thomas Edward
Emilio Santini Hugo Alberto
Lille Jeffrey S.
Nguyen Son Van
Chambliss Bahner & Stophel P.C.
Lynch David W.
Tugbang A. Dexter
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