Method for opening the plastic housing of an electronic module

Details Method for opening the plastic housing of an electronic module Method for opening the plastic housing of an electronic module

2006-10-24

2006-10-24

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Repair or restoration

C438S008000, C438S012000, C438S013000, C438S015000, C083S074000, C264S409000

Reexamination Certificate

active

07125729

ABSTRACT:
In a method of opening of a housing of a plastic-housed electronic module by a laser, the electronic module is protected from the effects of the laser beam and the laser beam is stopped at a suitable time by providing an end point signal detection due to the laser beam impinging on a protective layer. Thereby, after opening the housing, electrical measurements can be carried out on the electronic module.

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