Micromechanical resonator having a metal layer surrounding a...

Details Micromechanical resonator having a metal layer surrounding a... Micromechanical resonator having a metal layer surrounding a...

2006-08-15

2006-08-15

Summons, Barbara (Department: 2817)

Wave transmission lines and networks

Coupling networks

Electromechanical filter

C333S219000, C333S219100, C257S252000

Reexamination Certificate

active

07091801

ABSTRACT:
The invention relates to a micromechanical resonator having a bondable resonance body and a method for fabricating a micromechanical resonator for semiconductor components.The invention provides that the resonator (26) is composed successively of a first layer (16) of silicon for coupling the resonator (26) in terms of a circuit, an insulating layer (14) of silicon dioxide, a cylindrical base layer (cylinder18), and a metal layer (20) completely surrounding the cylinder (18).The method provides that a cylindrical structure (18) (cylinder) is etched (trench etching process) in a base layer (12) of p−-doped silicon (SOI wafer) separated from a layer (16) of silicon by an insulating layer (14), and the cylindrical structure (18) is coated with a metal layer (20).

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