Electroplating reactor

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C204S22400M, C204S275100, C204S277000, C204S297010, C204S288300, C204S286100, C205S291000

Reexamination Certificate

active

07118658

ABSTRACT:
A reactor for electroplating a workpiece includes a vessel having a ring contact arranged to support a workpiece in a horizontal orientation. In an embodiment of the invention, an electrode is arranged below the ring contact, and a pressing member is arranged above the ring contact to press a workpiece into electrical engagement with the ring contact. The vessel may be adapted to contain an electroplating fluid between a top of the ring contact and the electrode. In one embodiment, a movable intermediate workpiece support assembly is carried by the vessel, the support assembly being actuatable to lower a workpiece carried thereby to deliver the workpiece to be supported accurately and precisely on the ring contact.

REFERENCES:
patent: 3798003 (1974-03-01), Ensley et al.
patent: 4113577 (1978-09-01), Ross et al.
patent: 4137867 (1979-02-01), Aigo
patent: 4165252 (1979-08-01), Gibbs
patent: 4222834 (1980-09-01), Bacon et al.
patent: 4246088 (1981-01-01), Murphy et al.
patent: 4259166 (1981-03-01), Whitehurst
patent: 4304641 (1981-12-01), Grandai et al.
patent: 4339319 (1982-07-01), Aigo
patent: 4341629 (1982-07-01), Uhlinger
patent: 4360410 (1982-11-01), Fletcher et al.
patent: 4422915 (1983-12-01), Wielonski et al.
patent: 4466864 (1984-08-01), Bacon et al.
patent: 4469566 (1984-09-01), Wray
patent: 4576685 (1986-03-01), Goffredo et al.
patent: 4585539 (1986-04-01), Edson
patent: 4685414 (1987-08-01), DiRico
patent: 4696729 (1987-09-01), Santini
patent: 4715934 (1987-12-01), Tamminen
patent: 4741624 (1988-05-01), Barroyer
patent: 4868992 (1989-09-01), Crafts et al.
patent: 4913085 (1990-04-01), Vohringer et al.
patent: 5024746 (1991-06-01), Stierman et al.
patent: 5135636 (1992-08-01), Yee et al.
patent: 5139818 (1992-08-01), Mance
patent: 5169408 (1992-12-01), Biggerstaff et al.
patent: 5227041 (1993-07-01), Brogden et al.
patent: 5271953 (1993-12-01), Litteral
patent: 5271972 (1993-12-01), Kwok et al.
patent: 5310580 (1994-05-01), O'Sullivan et al.
patent: 5332271 (1994-07-01), Grant et al.
patent: 5340456 (1994-08-01), Mehler
patent: 5344491 (1994-09-01), Katou
patent: 5389496 (1995-02-01), Calvert et al.
patent: 5391285 (1995-02-01), Lytle et al.
patent: 5405518 (1995-04-01), Hsieh et al.
patent: 5427674 (1995-06-01), Langenskiold et al.
patent: 5441629 (1995-08-01), Kosaki
patent: 5443707 (1995-08-01), Mori
patent: 5447615 (1995-09-01), Ishida
patent: 5514258 (1996-05-01), Brinket et al.
patent: 5522975 (1996-06-01), Andricacos et al.
patent: 5550315 (1996-08-01), Stormont
patent: 5597460 (1997-01-01), Reynolds
patent: 5597836 (1997-01-01), Hackler et al.
patent: 5609239 (1997-03-01), Schlecker
patent: 5670034 (1997-09-01), Lowery
patent: 5683564 (1997-11-01), Reynolds
patent: 5684654 (1997-11-01), Searle et al.
patent: 5731678 (1998-03-01), Zila et al.
patent: 5744019 (1998-04-01), Ang
patent: 5747098 (1998-05-01), Larson
patent: 5755948 (1998-05-01), Lazaro et al.
patent: 5776327 (1998-07-01), Botts et al.
patent: 5788829 (1998-08-01), Joshi et al.
patent: 5829791 (1998-11-01), Kotsubo et al.
patent: 5843296 (1998-12-01), Greenspan
patent: 5904827 (1999-05-01), Reynolds
patent: 5909123 (1999-06-01), Budnaitis
patent: 5932077 (1999-08-01), Reynolds
patent: 5935330 (1999-08-01), Taniguchi
patent: 5980706 (1999-11-01), Bleck et al.
patent: 5985126 (1999-11-01), Bleck
patent: 6001235 (1999-12-01), Arken et al.
patent: 6027631 (2000-02-01), Broadbent
patent: 6080288 (2000-06-01), Schwartz et al.
patent: 6080291 (2000-06-01), Woodruff
patent: 6099702 (2000-08-01), Reid et al.
patent: 6103085 (2000-08-01), Woo et al.
patent: 6139712 (2000-10-01), Patton et al.
patent: 6143147 (2000-11-01), Jelinek
patent: 6156167 (2000-12-01), Patton et al.
patent: 6159354 (2000-12-01), Contolini et al.
patent: 6193859 (2001-02-01), Contolini et al.
patent: 6228231 (2001-05-01), Uzoh
patent: 6228232 (2001-05-01), Woodruff
patent: 6228233 (2001-05-01), Lakshmikanthan et al.
patent: 6251236 (2001-06-01), Stevens
patent: 6254742 (2001-07-01), Hanson et al.
patent: 6258223 (2001-07-01), Cheung et al.
patent: 6267853 (2001-07-01), Dordi et al.
patent: 6274013 (2001-08-01), Bleck et al.
patent: 6280582 (2001-08-01), Woodruff et al.
patent: 6280583 (2001-08-01), Woodruff et al.
patent: 6303010 (2001-10-01), Woodruff et al.
patent: 6309520 (2001-10-01), Woodruff et al.
patent: 6309524 (2001-10-01), Woodruff
patent: 6326587 (2001-12-01), Cardineau
patent: 6334937 (2002-01-01), Batz
patent: 6409892 (2002-06-01), Woodruff et al.
patent: 6428660 (2002-08-01), Woodruff et al.
patent: 6428662 (2002-08-01), Woodruff et al.
patent: 6527925 (2003-03-01), Batz et al.
patent: 6645356 (2003-11-01), Woodruff et al.
patent: 6669510 (2003-12-01), Yamawaki et al.
patent: 6699373 (2004-03-01), Woodruff et al.
patent: 2001/0000396 (2001-04-01), Dordi et al.
patent: 2003/0047448 (2003-03-01), Woodruff et al.
patent: 2003/0141185 (2003-07-01), Wilson et al.
patent: 2003/0173209 (2003-09-01), Batz et al.
patent: 2003/0196892 (2003-10-01), Batz et al.
patent: 2004/0035694 (2004-02-01), Batz et al.
patent: 4411427 (1992-11-01), None
patent: 9-2628886 (1997-04-01), None
patent: 2002-520489 (2002-07-01), None
patent: 573070 (2004-01-01), None
patent: WO-00/03067 (1998-07-01), None
patent: WO-99/25904 (1999-05-01), None
patent: WO-99/25905 (1999-05-01), None
patent: WO-00/03072 (2000-01-01), None
patent: WO-00/32835 (2000-06-01), None
patent: WO-00/40779 (2000-07-01), None
Buehler Simplement 2000-FN00682 and FN00935.
Parker (Editor), “McGraw-Hill Dictionary of Scientific and Technical Terms, Fifth Edition,” McGraw-Hill, Inc., 1994, definition of “bayonet coupling”.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electroplating reactor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroplating reactor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating reactor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3713041

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.