Methods, apparatus and systems for wafer-level burn-in...

Details Methods, apparatus and systems for wafer-level burn-in... Methods, apparatus and systems for wafer-level burn-in...

2006-10-17

2006-10-17

Hollington, Jermele (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

07123042

ABSTRACT:
A large-scale support carries semiconductor devices and at least one pair of common conductive regions in communication therewith. Each common conductive region is configured to be electrically connected with both a force contact and a sense contact of stress or test equipment. Such equipment includes at least one pair of force contacts for applying a force voltage across a pair of common conductive regions and, thus, across the support. A corresponding pair of sense contacts facilitates monitoring of a voltage applied across each of the semiconductor devices by the force contacts. Methods and systems for evaluating a voltage that has been applied to two or more semiconductor devices by way of a single pair of force contacts are also disclosed, as are methods and systems for, in response to a measured voltage, modifying the force voltage so that a desired voltage may be applied across each of the semiconductor devices.

REFERENCES:
patent: 5654588 (1997-08-01), Dasse et al.
patent: 5825193 (1998-10-01), Nakata et al.
patent: 5838161 (1998-11-01), Akram et al.
patent: 5886530 (1999-03-01), Fasnacht et al.
patent: 6020745 (2000-02-01), Taraci
patent: 6069480 (2000-05-01), Sabounchi et al.
patent: 6340302 (2002-01-01), Ladd

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