Enhanced flow channel for component cooling in computer systems

Details Enhanced flow channel for component cooling in computer systems Enhanced flow channel for component cooling in computer systems

2006-10-17

2006-10-17

Datskovsky, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S701000, C361S718000, C257S714000, C257S715000, C165S104330, C062S515000

Reexamination Certificate

active

07123479

ABSTRACT:
An evaporator having an enhanced flow channel design for use in a computer system is described. Specifically, micro-channels of the evaporator comprise nucleation sites and different channel widths. The enhanced flow channel design improves heat transfer from a computer component to a working fluid.

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patent: 6067712 (2000-05-01), Randlett et al.
patent: 6118656 (2000-09-01), Wang
patent: 6942018 (2005-09-01), Goodson et al.
patent: 2003/0062149 (2003-04-01), Goodson et al.

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