Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1999-09-16
2000-04-04
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361705, 361706, 361707, 361708, 361709, 361710, 257706, 257707, 257713, 257717, 257720, 174 163, 165 803, 165185, 156145, 156148, 156182, 156185, 428615, 428620, 428621, 428622, 428623, 428625, 428 362, H05K 720
Patent
active
060469072
ABSTRACT:
A heat conductor used by being disposed between a heat sink and electronic parts mounted on a printed circuit board. The heat conductor is layered by a heat conductive layer, made of silicone gel with alumina as a heat conductive filler dispersed therein, and a potentially adhesive layer. The potentially adhesive layer consists of a hot melt layer, with alumina as a heat conductive filler dispersed therein, and a heat resistant film, to facilitate formation of the hot melt layer, adhered to the heat conductive layer on one face of the heat resistant film. The heat conductor is set on the electronic parts so that the potentially adhesive layer abuts them, and is made to adhere to the electronic parts due to heating by means of reflow soldering to reach the phase change temperature of the adhesive.
REFERENCES:
patent: 4602678 (1986-07-01), Fick
patent: 4685987 (1987-08-01), Fick
patent: 4794981 (1989-01-01), Mizuno
patent: 5021300 (1991-06-01), Stacey
patent: 5095973 (1992-03-01), Toy
patent: 5164885 (1992-11-01), Drye et al.
patent: 5304269 (1994-04-01), Jacaruso et al.
patent: 5440172 (1995-08-01), Sutrina
patent: 5591034 (1997-01-01), Ameen et al.
patent: 5602720 (1997-02-01), Natsuhara et al.
patent: 5741579 (1998-04-01), Nishizawa
patent: 5781412 (1998-07-01), De Sorgo
patent: 5783862 (1998-07-01), Deeney
patent: 5945217 (1999-08-01), Hanrahan
patent: 5950066 (1999-09-01), Hanson et al.
patent: 5962348 (1999-10-01), Bootle et al.
Chervinsky Boris
Kitigawa Industries Co., Ltd.
Picard Leo P.
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