Toughened epoxy-anhydride no-flow underfill encapsulant

Details Toughened epoxy-anhydride no-flow underfill encapsulant Toughened epoxy-anhydride no-flow underfill encapsulant

2006-06-06

2006-06-06

Zimmer, Marc S (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C523S400000, C523S427000, C528S087000, C528S089000, C528S093000, C528S094000, C528S103000, C528S112000, C528S297000, C528S403000, C528S405000, C528S419000, C528S421000

Reexamination Certificate

active

07056978

ABSTRACT:
A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.

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Moon, Kyoung-Sik, et al.: “Study on the Effect of Toughening of No-Flow Underfill on Fillet Cracking”; 2001 Elec. Components and Tech. Conf.; 2001 IEEE.
Weaver, J. et al.: “Improving The Reliability And Performance Of Microelectronic Packaging”; ANTEC 2001; pp. 1340-1343.

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