Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate
2006-08-29
2006-08-29
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
Reexamination Certificate
active
07098118
ABSTRACT:
In a substrate machining method for machining a substrate, there are provided a substrate machining method in which a disk-like blade is rotated to cut the substrate from its one surface, and the cut surfaces of the substrate, which are positioned in the vicinity of the other surface of the substrate, are irradiated with laser light; and a substrate machining apparatus which carries out the substrate machining method. The entirety of the cut surfaces of the substrate may be irradiated with the laser light. The laser may be a YAG laser or a CO2laser. Further, a dicing tape may be adhered to the other surface of the substrate, and the laser light may be irradiated after cutting only the substrate and expanding the dicing tape. Modified layers are formed by an irradiation of the laser light, so that dice are prevented from being broken in an assembling operation of the dice.
REFERENCES:
patent: 4355457 (1982-10-01), Barlett et al.
patent: 4904610 (1990-02-01), Shyr
patent: 5543365 (1996-08-01), Wills et al.
patent: 5824177 (1998-10-01), Yoshihara et al.
patent: 6271102 (2001-08-01), Brouillette et al.
patent: 6602762 (2003-08-01), Hwan et al.
patent: 6734083 (2004-05-01), Kobayashi
patent: 6838299 (2005-01-01), Mulligan et al.
patent: 2001/0034564 (2001-10-01), Jones
patent: 2002/0031899 (2002-03-01), Manor
patent: 2004/0026382 (2004-02-01), Richerzhagen
patent: 2004/0188400 (2004-09-01), Peng et al.
patent: 2005/0003633 (2005-01-01), Mahle et al.
patent: 1 255 280 (2002-11-01), None
patent: 63-293939 (1988-11-01), None
patent: 2002-75919 (2002-03-01), None
patent: 2002-075919 (2002-03-01), None
Corresponding European Patent Application Search Report, dated Apr. 1, 2004.
Patent Abstract of Japan 63293939, dated Nov. 30, 1988, in the name of Shigeyuki.
Patent Abstract of Japan, Publication No. 2002075919 A, Published on Mar. 15, 2002, in the name of Kirihara.
Christie Parker & Hale LLP
Coleman W. David
Tokyo Seimitsu Co. Ltd.
LandOfFree
Method and apparatus for machining substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for machining substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for machining substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3707483